Cisco B200M4 server Rack Intel Xeon E5 v3 2.3 GHz 256 GB DDR4-SDRAM

Cisco B200M4. Processor family: Intel Xeon E5 v3, Processor frequency: 2.3 GHz, Processor model: E5-2670V3. Internal memory: 256 GB, Internal memory type: DDR4-SDRAM. Ethernet LAN. Chassis type: Rack

Manufacturer: Cisco

SKU: 11170150

Manufacturer part number: UCS-SPL-B200M4-A3

Vendor: Synnex

MSRP: $26,371.00

Price: $11,904.63

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The Cisco UCS B200 M4 solutions have the latest Intel E5-2670 v3 processors. More CPU cores on the Intel E5-2670 v3 help to process multiple tasks or heavily multi-threaded programs. It offers a balance of performance, versatility, and density without compromise. A powerhouse in a compact package, it offers maximum scalability, providing everything you need to get started with Cisco UCS. Each blade is pre-installed with 256GB of RAM upgradable to 768GB across 24 DIMMs, up to 2TB of internal storage, and up to 80Gbps of FCoE capable I/O throughput.

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Products specifications

Attribute name	Attribute value
Internal memory	256 GB
Internal memory type	DDR4-SDRAM
Memory clock speed	2133 MHz
ECC	Y
Operating temperature (T-T)	10 - 35 °C
Storage temperature (T-T)	-40 - 65 °C
Supported processor sockets	LGA 2011-v3 (Socket R)
Compatible processor series	Intel® Xeon®
Operating relative humidity (H-H)	5 - 93 %
Storage relative humidity (H-H)	5 - 93 %
Hot-Plug support	Y
Ethernet LAN	Y
Operating altitude	0 - 118110.2"
Non-operating altitude	0 - 472440.9"
RAID support	Y
RAID levels	0, 1
Chassis type	Rack
Processor frequency	2.3 GHz
Processor family	Intel Xeon E5 v3
Processor manufacturer	Intel
Processor model	E5-2670V3
Processor boost frequency	3.1 GHz
Processor cores	12
Processor threads	24
Processor cache	30 MB
Bus type	QPI
CPU configuration (max)	2
ECC supported by processor	Y
PCI Express configurations	x4, x8, x16
PCI Express slots version	3.0
Processor cache type	Smart Cache
Processor codename	Haswell
Processor lithography	22 nm
Processor operating modes	64-bit
Processor package size	52.5 x 45 mm
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Scalability	2S
Stepping	M1
Thermal Design Power (TDP)	120 W
Maximum internal memory supported by processor	768 GB
Memory bandwidth supported by processor (max)	68 GB/s
Conflict-Free processor	N
Memory slots	24
Optical drive type	N
Embedded options available	N
Enhanced Intel SpeedStep Technology	Y
Execute Disable Bit	Y
Idle States	Y
Intel 64	Y
Intel Dual Display Capable Technology	N
Intel Enhanced Halt State	Y
Intel Fast Memory Access	N
Intel FDI Technology	N
Intel Flex Memory Access	N
Intel Identity Protection Technology version	0.00
Intel Secure Key Technology version	1.00
Intel Trusted Execution Technology	Y
Intel TSX-NI	N
Intel TSX-NI version	0.00
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® AES New Instructions (Intel® AES-NI)	Y
Intel® Anti-Theft Technology (Intel® AT)	N
Intel® Clear Video HD Technology (Intel® CVT HD)	N
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Identity Protection Technology (Intel® IPT)	N
Intel® InTru™ 3D Technology	N
Intel® OS Guard	Y
Intel® Quick Sync Video Technology	N
Intel® Secure Key	Y
Intel® Smart Cache	Y
Intel® Turbo Boost Technology	2.0
Maximum number of PCI Express lanes	40
Number of QPI links	2
Thermal Monitoring Technologies	Y
Memory channels supported by processor	Quad
Memory types supported by processor	DDR4-SDRAM
Processor ARK ID	81709
Maximum storage capacity	3.2 TB
FSB Parity	N
Maximum internal memory	768 GB
Intel® Wireless Display (Intel® WiDi)	N
Intel® Insider™	N
Intel Clear Video Technology	N
Intel Demand Based Switching	Y
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)	N
Supported instruction sets	AVX 2.0
Physical Address Extension (PAE)	46 bit
Intel Rapid Storage Technology	N
Intel® My WiFi Technology (Intel® MWT)	N
System bus rate	9.6 GT/s
Memory clock speeds supported by processor	1600,1866,2133 MHz
Tcase	84.5 °C
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Number of processors installed	2
Internal drive bays	2

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Products specifications

Attribute name	Attribute value
Internal memory	256 GB
Internal memory type	DDR4-SDRAM
Memory clock speed	2133 MHz
ECC	Y
Operating temperature (T-T)	10 - 35 °C
Storage temperature (T-T)	-40 - 65 °C
Supported processor sockets	LGA 2011-v3 (Socket R)
Compatible processor series	Intel® Xeon®
Operating relative humidity (H-H)	5 - 93 %
Storage relative humidity (H-H)	5 - 93 %
Hot-Plug support	Y
Ethernet LAN	Y
Operating altitude	0 - 118110.2"
Non-operating altitude	0 - 472440.9"
RAID support	Y
RAID levels	0, 1
Chassis type	Rack
Processor frequency	2.3 GHz
Processor family	Intel Xeon E5 v3
Processor manufacturer	Intel
Processor model	E5-2670V3
Processor boost frequency	3.1 GHz
Processor cores	12
Processor threads	24
Processor cache	30 MB
Bus type	QPI
CPU configuration (max)	2
ECC supported by processor	Y
PCI Express configurations	x4, x8, x16
PCI Express slots version	3.0
Processor cache type	Smart Cache
Processor codename	Haswell
Processor lithography	22 nm
Processor operating modes	64-bit
Processor package size	52.5 x 45 mm
Processor series	Intel Xeon E5-2600 v3
Processor socket	LGA 2011-v3
Scalability	2S
Stepping	M1
Thermal Design Power (TDP)	120 W
Maximum internal memory supported by processor	768 GB
Memory bandwidth supported by processor (max)	68 GB/s
Conflict-Free processor	N
Memory slots	24
Optical drive type	N
Embedded options available	N
Enhanced Intel SpeedStep Technology	Y
Execute Disable Bit	Y
Idle States	Y
Intel 64	Y
Intel Dual Display Capable Technology	N
Intel Enhanced Halt State	Y
Intel Fast Memory Access	N
Intel FDI Technology	N
Intel Flex Memory Access	N
Intel Identity Protection Technology version	0.00
Intel Secure Key Technology version	1.00
Intel Trusted Execution Technology	Y
Intel TSX-NI	N
Intel TSX-NI version	0.00
Intel Virtualization Technology (VT-x)	Y
Intel Virtualization Technology for Directed I/O (VT-d)	Y
Intel VT-x with Extended Page Tables (EPT)	Y
Intel® AES New Instructions (Intel® AES-NI)	Y
Intel® Anti-Theft Technology (Intel® AT)	N
Intel® Clear Video HD Technology (Intel® CVT HD)	N
Intel® Hyper Threading Technology (Intel® HT Technology)	Y
Intel® Identity Protection Technology (Intel® IPT)	N
Intel® InTru™ 3D Technology	N
Intel® OS Guard	Y
Intel® Quick Sync Video Technology	N
Intel® Secure Key	Y
Intel® Smart Cache	Y
Intel® Turbo Boost Technology	2.0
Maximum number of PCI Express lanes	40
Number of QPI links	2
Thermal Monitoring Technologies	Y
Memory channels supported by processor	Quad
Memory types supported by processor	DDR4-SDRAM
Processor ARK ID	81709
Maximum storage capacity	3.2 TB
FSB Parity	N
Maximum internal memory	768 GB
Intel® Wireless Display (Intel® WiDi)	N
Intel® Insider™	N
Intel Clear Video Technology	N
Intel Demand Based Switching	Y
Intel® Clear Video Technology for Mobile Internet Devices (Intel CVT for MID)	N
Supported instruction sets	AVX 2.0
Physical Address Extension (PAE)	46 bit
Intel Rapid Storage Technology	N
Intel® My WiFi Technology (Intel® MWT)	N
System bus rate	9.6 GT/s
Memory clock speeds supported by processor	1600,1866,2133 MHz
Tcase	84.5 °C
Intel® Virtualization Technology (Intel® VT)	VT-d, VT-x
Number of processors installed	2
Internal drive bays	2