Xeon

Cisco E5-2670V3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Processor package size: 52.5 mm

Cisco Xeon E5-2670 v3 (30M Cache, 2.30 GHz). Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

Cisco Intel Xeon E5-2643 v2 6C 3.5GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: S2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Cisco Intel Xeon E5-2643 v2 6C 3.5GHz. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Cisco Intel Xeon E5-2660 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S. Processor package size: 52.5 mm

Cisco Xeon E5-2660 v3 (25M Cache, 2.60 GHz). Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

Cisco Xeon E5-2660 v2 (25M Cache, 2.20 GHz). Processor family: Intel® Xeon® E5 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 x 45 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

Cisco Intel Xeon E5-2660 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x

Cisco Xeon E5-2637 v4/135W 4C/15MB 3.50GHz. Processor family: Intel® Xeon® E5 v4, Processor socket: LGA 2011-v3, Processor lithography: 14 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 1536 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX 2.0, Scalability: 2S

Cisco Intel Xeon E5-2650 v2. Processor family: Intel® Xeon® E5 V2 Family, Processor socket: LGA 2011 (Socket R), Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR3-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S

Cisco E5-2650 v3. Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: 1x16, 1x4, 1x8, Supported instruction sets: AVX 2.0. Processor package size: 52.5 mm

Cisco Xeon E5-2650 v3 (25M Cache, 2.30 GHz). Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, Supported instruction sets: AVX, Scalability: 2S. Processor package size: 52.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB

Cisco Xeon E5-2637 v3 (15M Cache, 3.50 GHz). Processor family: Intel Xeon E5 v3, Processor socket: LGA 2011-v3, Processor lithography: 22 nm. Memory channels: Quad-channel, Maximum internal memory supported by processor: 768 GB, Memory types supported by processor: DDR4-SDRAM. Market segment: Server, PCI Express configurations: x4, x8, x16, Supported instruction sets: AVX. Processor package size: 52.5 mm. Intel® Virtualization Technology (Intel® VT): VT-d, VT-x, Maximum internal memory: 786432 MB, Cache memory: 15 MB

Cisco UCS B200 M3. Motherboard chipset: Intel C600, Processor socket: LGA 2011 (Socket R), Processor family: Intel. Supported memory types: DDR3-SDRAM, Maximum internal memory: 768 GB, Memory form factor: 240-pin DIMM. Storage drive sizes supported: 2.5", Supported storage drive interfaces: Serial Attached SCSI (SAS), Serial ATA III, RAID levels: 0, 1. On-board graphics card model: Matrox G200. Product color: Silver

Intel Xeon E7420. Processor family: Intel® Xeon® E7 Family, Processor socket: Socket 604 (mPGA604), Processor lithography: 45 nm. Market segment: Server, Number of Processing Die Transistors: 1900 M, Processing Die size: 503 mm². Package width: 1.73" (44 mm), Package depth: 5.51" (140 mm), Package height: 4.61" (117 mm). Processor package size: 53.3mm x 53.3mm. Images Type Map: